Parylene Conformal Coat for Circuit Card Assemblies

Project number: 
22039
Sponsor: 
Honeywell Aerospace
Academic year: 
2021-2022
Parylene coating is a barrier that protects a circuit card from environmental threats, such as contaminants, moisture and temperature, while providing dielectric properties. Its durability makes it an ideal choice as a barrier, but also makes it difficult to remove when the circuit card needs to be repaired. Removal requires a lot of time, money, labor, and even dangerous chemicals, which can pose potential damage risks. In this project, the team tested and provided various methods, such as abrasion, reactive ion etching, and laser ablation, to effectively remove the coating without damaging the board. They tested the laser removal with a device they designed and built, which can be controlled by a user interface and allows for complete board and spot removal of Parylene.

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