Project number
26034
Organization
Raytheon Technologies
Offering
ENGR498-F2025-S2026
Students will design and test a rig to anchor the potential thermally diodic effects of constructions involving Shape Memory Alloys for controlling heat flow into and out of sensitive electronics. In the 2025-2026 year students will leverage progress and equipment developed by the 2024-2025 team to improve the test rig and to test a more complex multi-layer construction.