Waveguide Metrology Tool Prototype

As AI frameworks continue to evolve at a rapid pace, next generation of CPO (Co-Packaged Optics) architectures are necessary to meet the increased demand for bandwidth and energy efficient data transmission. Glass Core Substrates can enable large scale integration of multiple chiplets in a package due to its tunable modulus, dimensional stability and a Coefficient of Thermal Expansion (CTE) that is closer to that of silicon. It can also enable an integrated photonic-electronic platform as electrical wiring, and optical waveguides can co-exist in the same glass substrate. Formation of sharp, defect free and precisely located waveguides is a must for enabling such a platform. While significant strides are being made to form these glass waveguides, metrologies to accurately characterize are pre-mature or lacking.