Co-package Optics (CPO): Vertical out-coupling from edge coupling array to photodetectors

Design, build, and experimentally validate a complete micro-optics solution for next-generation co-packaged optics, enabling efficient vertical coupling of light from a dense one-dimensional photonic integrated circuit (PIC) waveguide array to a far-field photodetector array. Students will tackle real-world engineering challenges spanning optical design, tolerance analysis, component selection, prototype assembly, and performance characterization, with goals of achieving high transmission, low crosstalk, and effective polarization separation.

***This project is conducting remote interviews. Please see remote interview sheet on BrightSpace (D2L) to schedule a time to speak to the sponsor.***