Project number
27071
Organization
ASML US, Inc.
Offering
ENGR498-F2026-S2027
This capstone project will develop a visible-range imaging module using a non-rotationally symmetric optical design, such as cylindrical, anamorphic, tilted, off-axis, or freeform elements, for applications where conventional rotationally symmetric optics cannot meet field of view, image quality, magnification, or packaging needs. The team will define optical requirements, create a Zemax or equivalent optical model, develop a photon budget, assess tolerances and alignment sensitivity, design the optomechanical packaging, integrate detector and illumination electronics, and build a working prototype or breadboard using off-the-shelf and/or quick-turn components. Success will be measured by demonstrating the intended asymmetric imaging behavior and verifying key performance metrics such as resolution, distortion, field coverage, modulation transfer function, signal-to-noise ratio, repeatability, alignment stability, and packaging feasibility.
Key Deliverables
• Clever, descriptive project name with an acronym that is easy to remember
• Optical requirements document
• Non-rotationally symmetric optical concept trade study
• Zemax or equivalent optical design model
• Photon budget
• Detector, illumination, and optical component selection
• Electrical interface and signal chain design
• Tolerance and alignment sensitivity analysis
• Optomechanical packaging design
• Working prototype or breadboard demonstration
• Prototype verification test data
• Stray-light and image artifact assessment
• Final technical report and presentation
***This project is conducting remote interviews. Please see remote interview sheet on BrightSpace (D2L) to schedule a time to speak to the sponsor.***
Key Deliverables
• Clever, descriptive project name with an acronym that is easy to remember
• Optical requirements document
• Non-rotationally symmetric optical concept trade study
• Zemax or equivalent optical design model
• Photon budget
• Detector, illumination, and optical component selection
• Electrical interface and signal chain design
• Tolerance and alignment sensitivity analysis
• Optomechanical packaging design
• Working prototype or breadboard demonstration
• Prototype verification test data
• Stray-light and image artifact assessment
• Final technical report and presentation
***This project is conducting remote interviews. Please see remote interview sheet on BrightSpace (D2L) to schedule a time to speak to the sponsor.***