Project number
25024
Organization
Northrop Grumman
Offering
ENGR498-F2024-S2025
Summary
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Northrop Grumman Corporation (NGC) is looking to build mature “Beta” level prototypes for a new generation of Electrical Ground Support Equipment for launch vehicles.
Northrop Grumman utilizes a common architecture of Electrical Ground Support Equipment (EGSE) to integrate, test, and launch our rocket and missile products at launch facilities around the world. The existing common architecture is focused on maximum design flexibility, field rework, and use of Mil-Spec components. Today our largest bottleneck with EGSE design and production schedules is completing the procurement and manufacture of components early enough to kickoff security processes on time (needed prior to launch vehicle integration). With a greater volume of EGSE being produced today than ever before, NGC is looking towards a new generation of EGSE which focuses on modularity, condensing components and wiring onto PCBs, part interchangeability and sustainability, and reduced lead and build time.
The concept of this project is the create specific hardware/firmware items that will be used in the future common architecture of EGSE. This would include a subset of the following depending on the team’s preference:
• A complex Circuit Card Assembly (CCA) for power switching, power isolation, or discrete control.
• A common daughter board CCA and firmware for motherboard command and control (microcontroller/FPGA based).
• Adapter modules for power distribution, grounding, or for adapting high density connectors to D38999.
• Custom, rackmount, modular mechanical housings that meet environmental (shock, vibe, thermal, salt fog, bonding, etc.) and cost requirements.
Goals
--------------------------
• Design and build low-cost, high-density, reliable, custom circuit card assemblies that fit within NGC defined mechanical constraints.
• Using an NGC provided Interface Control Document (ICD), design electrical circuits, firmware/software, and mechanical housings.
• Electrical and mechanical part selection should be focused on longevity and availability. Part interchangeability should be prioritized along with selecting microcontrollers/FPGAs with long-term availability. Security constraints with non-volatile memory need to be considered.
• Should use engineering principles for drawings and digital design file formatting.
• Firmware/software design should follow a software development lifecycle and include deliverable documentation. A demo control and status application will be needed to exercise the hardware and demonstrate functionality.
• Software should utilize open-source and/or U.S. based 3rd party libraries.
• Engineering disciplines must coordinate requirements and design data to ensure interfaces between mechanical/electrical and electrical/software products are compatible.
---------------------------------------
Northrop Grumman Corporation (NGC) is looking to build mature “Beta” level prototypes for a new generation of Electrical Ground Support Equipment for launch vehicles.
Northrop Grumman utilizes a common architecture of Electrical Ground Support Equipment (EGSE) to integrate, test, and launch our rocket and missile products at launch facilities around the world. The existing common architecture is focused on maximum design flexibility, field rework, and use of Mil-Spec components. Today our largest bottleneck with EGSE design and production schedules is completing the procurement and manufacture of components early enough to kickoff security processes on time (needed prior to launch vehicle integration). With a greater volume of EGSE being produced today than ever before, NGC is looking towards a new generation of EGSE which focuses on modularity, condensing components and wiring onto PCBs, part interchangeability and sustainability, and reduced lead and build time.
The concept of this project is the create specific hardware/firmware items that will be used in the future common architecture of EGSE. This would include a subset of the following depending on the team’s preference:
• A complex Circuit Card Assembly (CCA) for power switching, power isolation, or discrete control.
• A common daughter board CCA and firmware for motherboard command and control (microcontroller/FPGA based).
• Adapter modules for power distribution, grounding, or for adapting high density connectors to D38999.
• Custom, rackmount, modular mechanical housings that meet environmental (shock, vibe, thermal, salt fog, bonding, etc.) and cost requirements.
Goals
--------------------------
• Design and build low-cost, high-density, reliable, custom circuit card assemblies that fit within NGC defined mechanical constraints.
• Using an NGC provided Interface Control Document (ICD), design electrical circuits, firmware/software, and mechanical housings.
• Electrical and mechanical part selection should be focused on longevity and availability. Part interchangeability should be prioritized along with selecting microcontrollers/FPGAs with long-term availability. Security constraints with non-volatile memory need to be considered.
• Should use engineering principles for drawings and digital design file formatting.
• Firmware/software design should follow a software development lifecycle and include deliverable documentation. A demo control and status application will be needed to exercise the hardware and demonstrate functionality.
• Software should utilize open-source and/or U.S. based 3rd party libraries.
• Engineering disciplines must coordinate requirements and design data to ensure interfaces between mechanical/electrical and electrical/software products are compatible.