Avionics Size Reduction and Thermal Reliability Enhancement

As electronic components have progressively improved capabilities with regard to their Size, Weight, and Power (SWaP), engineers are faced with challenges inherent to increased thermal density and reliability targets for packaged electronic equipment. In the aerospace industry, engineers designing aviation electronics (avionics) products such as radios, displays, and flight data recorders for L3Harris Commercial Aviation Solutions are seeing these challenges firsthand. A new market in Urban Air Mobility (UAM), featuring electric vertical take-off and landing (eVTOL) aircraft, pushes these product requirements to an extreme.

The project team will work with engineers from L3Harris to define, analyze, develop, and test enhancements to avionics products to support new customer requirements for Air Transport and Urban Air Mobility (UAM).